Hot melt adhesive piezoelectric valve

Hot Melts Micro Dispensing System

< Piezo injection valve >

•The hot melt injection valve consists of a rubber barrel heating module, a pressurizing cap module, a nozzle heating module, a runner module, a valve body module and a heat dissipation module. The glue barrel heating module carries the glue barrel and one-stage heating, the temperature is controllable, and completes the preliminary heating of the glue.

•The pressure cap module seals and pressurizes the rubber barrel, and controls the output pressure through the controller. The heat dissipation module dissipates heat from the valve body and reduces the noise of the valve body.

•The piezoelectric injection valve adopts a modular design, the part in contact with the colloid is designed as a flow channel module, and the part that is not in contact with the colloid is designed as a valve body module. In different applications, the dispensing needs can be met by replacing the flow channel module.

•Nozzle diameters come in series ( from 40µm to 500µm), and the nozzles are divided into flat jet type, needle type, and extended type.

•Runner modules require regular cleaning in an ultrasonic cleaner. The sealing ring cannot be soaked in organic solvents. Use special tools to clean the nozzle to prevent damage to the nozzle.

< Jet valve controller >

•The touch screen controls the piezoelectric injection valve and dispensing system, and supports the MES system with powerful functions, safety and reliability.

• The touch screen adopts graphic control mode, and the composition of dispensing system components and control display functions are displayed in graphic form, which is concise, intuitive and clear.

< Nozzle heater >

•The nozzle needs to be heated to the proper temperature before dispensing. The heating device adopts two-stage heating method.

• at the glue barrel and nozzle to keep the colloid at a constant temperature and meet the best performance of the colloid.

< Application field >

Bonding and sealing of mobile phone casings, packaging of new energy batteries, bonding and sealing of touch screens of various electronic products, packaging of mobile phone speakers and receivers, packaging of high-end earphones and audio casings, packaging of fingerprint recognition modules .

< Jet Hot Melt Adhesive Performance >

1.The rubber cartridge heating is suitable for 30CC , 100CC and 300CC hot melt adhesives with different volumes .

2.Modular design, easy to replace parts, easy to debug, wide range of process applications .

3. The injection volume can be accurate to 0.3nL , and the consistency accuracy of the injection glue point is as high as 98 % .

4.It can realize the minimum line width of 0.17mm and the minimum point diameter of 0.15mm hot melt glue injection process .

5. It can match any sports platform on the market .

• high speed

• High flexibility

• High precision and high stability

• Easy to disassemble, wash and maintain

• Independent stroke adjustment

• Modular

Focus on application

• Underfill • Pin Encapsulation • Precision Coating • Bonding • Sealing • Potting • Dam & Filling

Applicable fluid

• Underfill Adhesive • Epoxy Adhesive • UV Adhesive • Conductive Adhesive • Silver Paste • Ink • Red Adhesive

Specifications