JHIMS - Hot melt micro dispensing head

Hot melt micro dispensing head

• Rubber Barrel Heating Module: Provides controlled heating for glue.
• Pressurizing Cap Module: Seals and controls output pressure.
• Nozzle Heating Module: Maintains optimal temperature during dispensing.
• Runner Module: Features a modular design for flexible applications.
• Valve Body Module: Ensures stability and reliability.
• Heat Dissipation Module: Reduces noise and dissipates heat.

• Diameters from 40µm to 500µm  
• Types: Flat jet, needle, and extended  

•  Regular cleaning in ultrasonic cleaner is required.
• Avoid soaking sealing rings in organic solvents.

• Graphic interface for intuitive operation.  
• Supports MES systems for enhanced functionality and reliability.

• Heating Method: Two-stage heating to maintain constant temperature at the glue barrel and nozzle.

• Compatibility: Suitable for 30CC, 100CC, and 300CC hot melt adhesives.  
• Modular Design: Facilitates easy part replacement and debugging.  
• Precision: Injection volume accuracy of 0.3nL with 98% consistency.  
• Line Width: Minimum of 0.17mm with point diameter as small as 0.15mm.  
• Platform Compatibility: Works with all major sports platforms.

• High speed and flexibility  
• Exceptional precision and stability  
• Easy disassembly and maintenance  
• Independent stroke adjustment  

• Underfill  
• Pin encapsulation  
• Precision coating  
• Bonding and sealing  
• Potting  
• Dam & filling  

• Underfill Adhesive  
• Epoxy Adhesive  
• UV Adhesive  
• Conductive Adhesive  
• Silver Paste  
• Ink  
• Red Adhesive  

Ⅹ、Specifications：

Ⅺ、Product Size：