JHIMS - Glue Adhesive Dispensing systems

JHIMS - Glue Adhesive Dispensing systems

Product Number:JH-PF-QD100-500 Dispensing head

Product Usage:The Glue Adhesive Dispensing systems is a high-precision, high-efficiency device that uses piezoelectric technology for accurate, high-frequency glue spraying, ideal for microelectronic packaging and contactless applications.

Applicable Industries:Glue Adhesive Dispensing systems are widely used in consumer electronics, photovoltaics, automotive industries, as well as in energy, acoustics, optics, MEMS, and RFID fields that require high precision, efficiency, and non-contact operation.

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High-Speed Glue Adhesive Dispensing systems 
High-Speed Glue Adhesive Dispensing systems
Ⅰ、Product Code:
JH-PF-QD100/200/300/400/500
 
Ⅱ、Product Overview:  
The JH-PF-QD100 is a non-contact dispensing head designed for precise, high-frequency glue application. Using piezoelectric technology, it delivers high-precision, high-speed glue dispensing suitable for microelectronics packaging, contactless assembly, and similar applications. Its modular design ensures high efficiency and adaptability across varied production lines.
 
Ⅲ、Key Industries:
1. Consumer Electronics: Ensures accurate glue application in assembling devices like smartphones, tablets, and TVs.
2. Photovoltaics: Used in solar panel production for bonding solar cells and other components.
3. Automotive: Employed in sealing, bonding, and fixing applications, including car lights and dashboards.
4. Additional Applications: Energy, acoustics, optics, MEMS, RFID, where precision and non-contact operation are crucial.
 
Ⅳ、Working Principle:  
The jet dispensing head operates by controlling air pressure and valve switching to achieve contactless glue ejection. When air pressure is applied, it pushes the valve core, allowing glue to flow into the nozzle and be dispensed at high precision. This system’s design ensures a controlled, reliable dispensing flow.
 
Ⅴ、Components and Features:
  • Non-Contact Pneumatic Injection Head: Provides high-speed, precise jetting with adjustable spring pressure and air cooling for durability.
  • Jet Valve Controller: Touchscreen-controlled, supporting MES systems for secure, reliable operation with an intuitive graphic interface.
  • Nozzle Heater: Maintains consistent glue temperature for optimal performance using a single-level heating system.
 
Ⅵ、Applications:
Ideal for bonding in camera modules, circuit boards, frame bonding, fingerprint modules, sensor units, and power potting.
 

Ⅶ、Specifications:

parameter

value

Product number

JH-PF-QD100…800

driving voltage

24V

Minimum driving air pressure

0.6-0.8mPa (90Psi)

Barrel pressure

0-0.4mPa (50Psi)

Body material

aluminum alloy

Fluid body material

SUS304

Piston seal

PTFE synthetic material

Firing pin seal

PEK/PTFE/PE optional

Firing pin material

super cemented carbide

Nozzle material

super cemented carbide

Body temperature

≤ 100 °C

Nozzle temperature

room temperature ~ 130 ℃

Dimensions

24 × 90 × 160mm

individual weight

0.55kg

Applicable liquid

It can be used for various fluids and adhesives such as: bottom filling glue, UV glue, silver paste,

High-speed and volume-controlled dispensing of silicone, epoxy, surface coating, surface mount, etc.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Dispensing head keywords:
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