High-Speed Glue Adhesive Dispensing systems
Ⅰ、Product Code:
JH-PF-QD100/200/300/400/500
Ⅱ、Product Overview:
The JH-PF-QD100 is a non-contact dispensing head designed for precise, high-frequency glue application. Using piezoelectric technology, it delivers high-precision, high-speed glue dispensing suitable for microelectronics packaging, contactless assembly, and similar applications. Its modular design ensures high efficiency and adaptability across varied production lines.
Ⅲ、Key Industries:
1. Consumer Electronics: Ensures accurate glue application in assembling devices like smartphones, tablets, and TVs.
2. Photovoltaics: Used in solar panel production for bonding solar cells and other components.
3. Automotive: Employed in sealing, bonding, and fixing applications, including car lights and dashboards.
4. Additional Applications: Energy, acoustics, optics, MEMS, RFID, where precision and non-contact operation are crucial.
Ⅳ、Working Principle:
The jet dispensing head operates by controlling air pressure and valve switching to achieve contactless glue ejection. When air pressure is applied, it pushes the valve core, allowing glue to flow into the nozzle and be dispensed at high precision. This system’s design ensures a controlled, reliable dispensing flow.
Ⅴ、Components and Features:
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Non-Contact Pneumatic Injection Head: Provides high-speed, precise jetting with adjustable spring pressure and air cooling for durability.
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Jet Valve Controller: Touchscreen-controlled, supporting MES systems for secure, reliable operation with an intuitive graphic interface.
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Nozzle Heater: Maintains consistent glue temperature for optimal performance using a single-level heating system.
Ⅵ、Applications:
Ideal for bonding in camera modules, circuit boards, frame bonding, fingerprint modules, sensor units, and power potting.
Ⅶ、Specifications:
parameter
|
value
|
Product number
|
JH-PF-QD100…800
|
driving voltage
|
24V
|
Minimum driving air pressure
|
0.6-0.8mPa (90Psi)
|
Barrel pressure
|
0-0.4mPa (50Psi)
|
Body material
|
aluminum alloy
|
Fluid body material
|
SUS304
|
Piston seal
|
PTFE synthetic material
|
Firing pin seal
|
PEK/PTFE/PE optional
|
Firing pin material
|
super cemented carbide
|
Nozzle material
|
super cemented carbide
|
Body temperature
|
≤ 100 °C
|
Nozzle temperature
|
room temperature ~ 130 ℃
|
Dimensions
|
24 × 90 × 160mm
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individual weight
|
0.55kg
|
Applicable liquid
|
It can be used for various fluids and adhesives such as: bottom filling glue, UV glue, silver paste,
High-speed and volume-controlled dispensing of silicone, epoxy, surface coating, surface mount, etc.
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Dispensing head keywords:
Recirculating dispensing valve#Anti-drip dispensing#Precision dispensing valve#Dispensing valve with recirculating function#Automatic dispensing equipment#High viscosity dispensing#Micro-dispensing control#Anti-stringing dispensing#Dispensing machine#Recirculating function#Dispensing accuracy#Glue recirculation#Dispensing applications#Electronic dispensing#Dispensing equipment#Dispensing valve maintenance#Dispensing valve selection#Industrial dispensing#Efficient dispensing#Dispensing process
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