GKG G3000K GDJ1-04 Dispensing Nozzle for SMT

Name: GKG G3000K GDJ1-04 Dispensing Nozzle
Brand: GKG
SKU: GDJ1-04-31
Price: 60 USD
Availability: InStock
Rating: 4.9 (32 reviews)

Product Number：GDJ1-04-31 GKG dispensing nozzle parts

Product Usage：The dispenser nozzle is one of the key components of the dispensing machine. It is responsible for accurately delivering glue or other fluid materials to the work surface.

Applicable Industries：Dispenser nozzle firing pins from various brands are used to precisely control the release of liquid or glue to ensure accuracy and consistency in the dispensing process.

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GKG G3000K GDJ1-04 Dispensing Nozzle for SMT Machines

1. Product Overview

The GKG G3000K GDJ1-04 Dispensing Nozzle is a high-precision component designed for GKG G3000K dispensing valves in Surface Mount Technology (SMT) applications. Made from durable materials like tungsten steel, diamond, and ceramics, this nozzle ensures wear and corrosion resistance, ideal for electronics manufacturing. It delivers precise glue dispensing for consistent results in PCB assembly.

2. Key Features

Precision Dispensing: Ensures accurate glue application for consistent results.
Durable Materials: Tungsten steel, diamond, and ceramics for long-term use.
Easy Maintenance: Simple design for quick disassembly and cleaning.
Wide Compatibility: Supports epoxy resin, silicone, and UV-curing glues.

3. Working Principle

The GKG G3000K GDJ1-04 nozzle controls glue flow through a precise needle mechanism driven by a solenoid valve or similar device. When dispensing is required, the system signals the needle to open the nozzle, allowing glue to flow. After dispensing, the needle closes the nozzle, ensuring consistent and accurate application.

4. Technical Specifications

Specification	Details
Material	Tungsten steel, diamond, ceramics
Compatibility	GKG G3000K dispensing valve
Glue Types	Epoxy resin, silicone, UV-curing glue
Product Number	GDJ1-04-31
Nozzle Aperture Accuracy	0.03mm
Nozzle Finish	Ra0.1 (mirror surface)
Nozzle Concentricity	0.002mm
Nozzle Hardness	85-95 HR
Operating Temperature	-55 to 260°C
Processing Method	Precision grinding

5. Applications

This SMT dispensing nozzle is used for precise glue application in industries such as:

Electronics manufacturing
Automotive electronics
Medical device production
Photovoltaic solar energy
LCD/LED manufacturing
Semiconductor packaging
PCB assembly
Optics and optoelectronics
Pharmaceutical industry
Auto parts coating
Chip bonding

6. How to Use

To ensure optimal performance of the GKG G3000K GDJ1-04 Dispensing Nozzle:

Select the appropriate nozzle size based on dispensing volume and accuracy needs.
Ensure the GKG G3000K dispensing valve is clean and free of debris.
Attach the GDJ1-04 nozzle securely to the valve.
Configure the dispensing machine settings for the desired glue type.
Test the nozzle to ensure accurate glue flow.

7. Maintenance Tips

Clean the nozzle after each use to prevent glue buildup.
Inspect for wear and replace if performance declines.
Store in a dry, dust-free environment.
Use compatible glues to prevent corrosion or damage.

8. Frequently Asked Questions

1. What are the types of precision dispensing technologies in SMT?

Precision dispensing in SMT can be classified into three main technologies:

Stencil Printing: Uses a stencil to transfer adhesive onto the PCB.
Contact Dispensing: The dispensing head contacts the PCB to apply adhesive.
Non-contact Jet Dispensing: Adhesive is jetted onto the PCB without physical contact.

2. What factors affect the quality of dispensing?

Several factors influence dispensing quality:

Viscosity of the adhesive
Amount of glue dispensed
Positioning accuracy
Dispensing pressure
Nozzle size
Distance between nozzle and PCB
Temperature of the glue
Curing characteristics of the adhesive

3. How should I choose the nozzle size for my dispensing application?

The inner diameter of the nozzle should be approximately half the diameter of the dispensing point. For example, for 0805 and 1206 pads, use a nozzle with the same inner diameter.

4. What is the recommended distance between the nozzle and the PCB?

The distance should ensure an appropriate aspect ratio of the glue dots. For low-viscosity adhesives, a 3:1 ratio is recommended, while for high-viscosity solder pastes, a 2:1 ratio is suitable.

5. How should I store and handle glue to maintain dispensing accuracy?

Store epoxy resin glue at 0 to 5°C and use it at 23-25°C. A 5°C temperature difference can cause a 50% change in dispensing volume, so maintain consistent temperature.