Product Number:GDJ1-04-31 GKG dispensing nozzle parts
Product Usage:The dispenser nozzle is one of the key components of the dispensing machine. It is responsible for accurately delivering glue or other fluid materials to the work surface.
Applicable Industries:Dispenser nozzle firing pins from various brands are used to precisely control the release of liquid or glue to ensure accuracy and consistency in the dispensing process.
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The GKG G3000K GDJ1-04 Dispensing Nozzle is a high-precision component designed for GKG G3000K dispensing valves in Surface Mount Technology (SMT) applications. Made from durable materials like tungsten steel, diamond, and ceramics, this nozzle ensures wear and corrosion resistance, ideal for electronics manufacturing. It delivers precise glue dispensing for consistent results in PCB assembly.
The GKG G3000K GDJ1-04 nozzle controls glue flow through a precise needle mechanism driven by a solenoid valve or similar device. When dispensing is required, the system signals the needle to open the nozzle, allowing glue to flow. After dispensing, the needle closes the nozzle, ensuring consistent and accurate application.
Specification | Details |
---|---|
Material | Tungsten steel, diamond, ceramics |
Compatibility | GKG G3000K dispensing valve |
Glue Types | Epoxy resin, silicone, UV-curing glue |
Product Number | GDJ1-04-31 |
Nozzle Aperture Accuracy | 0.03mm |
Nozzle Finish | Ra0.1 (mirror surface) |
Nozzle Concentricity | 0.002mm |
Nozzle Hardness | 85-95 HR |
Operating Temperature | -55 to 260°C |
Processing Method | Precision grinding |
This SMT dispensing nozzle is used for precise glue application in industries such as:
To ensure optimal performance of the GKG G3000K GDJ1-04 Dispensing Nozzle:
Precision dispensing in SMT can be classified into three main technologies:
Several factors influence dispensing quality:
The inner diameter of the nozzle should be approximately half the diameter of the dispensing point. For example, for 0805 and 1206 pads, use a nozzle with the same inner diameter.
The distance should ensure an appropriate aspect ratio of the glue dots. For low-viscosity adhesives, a 3:1 ratio is recommended, while for high-viscosity solder pastes, a 2:1 ratio is suitable.
Store epoxy resin glue at 0 to 5°C and use it at 23-25°C. A 5°C temperature difference can cause a 50% change in dispensing volume, so maintain consistent temperature.
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