Product Number:PTS330
Product Usage:CCD high-precision glue dispensing machines are mainly used to achieve accurate and efficient glue dispensing and packaging operations in the fields of electronic manufacturing, medical equipment and automotive parts.
Applicable Industries:Applications: 3C consumer electronics, automotive aerospace, LED panel lights, semiconductors, microelectronics, biotechnology, semiconductor catheter spraying
National Advisory Hotline:
+86 18975335491CCD high precision small dispensing machine
6.High speed: No need for Z-axis movement necessary for traditional needle dispensing technology, and the dispensing speed is more than 3 times that of needle dispensing
7.High precision: the smallest dispensing volume can reach nanoliters, the smallest dot diameter can be controlled to 0.2mm, and it has a consistency that traditional needle dispensing can't match.
8.High flexibility: Dispensing is highly insensitive, which can avoid problems caused by the needle colliding with the workpiece; the extremely small amount of glue can be operated in a more compact space, completing the dispensing process that 9.cannot be achieved with needle dispensing
10.Low maintenance and long life: advanced structure design, daily cleaning and maintenance are simple and easy, the most advanced nano wear-resistant material accessories, is more than 20 times the life of ordinary materials.
2、CCD high-precision small dispensing machine application industry:
3、Specification Table
Maximum dispensing frequency |
250HZ |
Minimum drive pressure |
0.6MPA |
Applicable glue type |
Adhesives, lubricants, water solvents, liquid polymers, etc. |
Applicable viscosity range |
0-380000CPS |
Maximum allowable diameter of particles in glue |
30MM |
Applicable ambient temperature |
-20~+85 degrees Celsius |
Dispensing accuracy |
2% (under the same pressure and temperature) |
Bottom open time |
2Ms |
Minimum pause time |
2Ms |
4、Jet dispensing machine industry application
1. Mobile phone narrow side control
2. Undertill
3. FPC soft board
4. PCB board dispensing
5. Semiconductor microelectronics assembly
6. Camera module (Lens petal fixing, VCM dispensing, etc.)