JHE Solder Paste Printer
The fully automatic solder paste printer is a new product for high-end SMT applications. It can perfectly meet the process requirements of fine pitch, high precision and high speed such as 03015 and 0.25pich.
1、Introduction to the standard functions of the fully automatic solder paste printer:
1. CCD digital camera system
The new optical path system - uniform annular light and high-brightness coaxial light, with infinitely adjustable brightness function, makes all types of Mark points well identifiable (including uneven Mark points) to adapt to tin-plated, copper-plated, gold-plated, tin-sprayed, FPC and other types of PCBs of different colors.
2. High-precision PCB thickness adjustment lifting platform
The structure is compact and reliable, the lifting and lowering are stable, and the PIN height is automatically adjusted by software, which can accurately adjust the position height of PCB boards of different thicknesses.
3. Guide rail positioning system
International utility model invention patent. The detachable and programmable flexible side clamp device performs unique top flattening for soft boards and warped PCBs. Through software programming, it can automatically retract without affecting the tin thickness.
4. Brand-new scraper structure design
Adopt a new hybrid scraper system to improve operation stability and extend service life.
5. High-speed screen cleaning
The drip cleaning structure effectively prevents the local solvent-free caused by the blockage of the solvent tube, which causes the wiping to be unclean, and the drip length can be controlled by software.
6. Brand-new multi-functional interface
Concise and clear, easy to operate. Real-time temperature remote control function.
2、Optional functions of the fully automatic solder paste printer:
1. Steel mesh detection function
By performing light source compensation above the steel mesh, using CCD to check the mesh of the steel mesh in real time, it can quickly detect and determine whether the steel mesh is blocked after cleaning, and automatically clean it, which is a supplement to the 2D detection of the PCB board.
2. Automatic dispensing system
According to different printing process requirements, the PCB board can be accurately dispensed, tinned, drawn, filled and other functions after printing; at the same time, the dispensing machine head is also equipped with a heating function, which can heat the glue when the ambient temperature is low to improve the fluidity of the glue.
3. Bottle-type automatic tinning and solder paste detection function
Mobile automatic soldering ensures the quality of solder paste and the amount of solder paste in the steel mesh, thereby ensuring the printing quality of customers and improving productivity.
Through the detection device, the solder paste residue on the steel mesh is intelligently managed and can form a closed-loop control with automatic tinning to ensure the quality of solder paste.
4. SPI connection
Connected with SPI to form a closed-loop system. When receiving feedback information about poor SPI printing, the machine will automatically adjust according to the SPI feedback offset. The XY direction offset can be automatically adjusted within 3PCS, and the steel mesh will be cleaned to improve printing quality and production efficiency, forming a complete printing feedback system.
5. Leading the compatibility of Industry 4.0
Through the automatic upload or output of machine status and parameters, it provides strong guarantees for customers' industrial 4.0 intelligent production. It can achieve seamless docking with the customer's MES system and achieve high traceability of products; intelligent control of equipment maintenance, and self-allocation of engineering personnel at all levels according to on-site management.
6. BTB
BTB provides users with greater flexibility in production line configuration, allowing them to take advantage of the excellent printer performance of BTB and obtain dual-channel output.
3、Fully automatic solder paste printer technical parameters and specifications:
|
Substrate |
|
Maximum substrate size (X×Y) |
450×340mm |
|
Minimum substrate size |
50×50mm |
|
Substrate thickness |
0.4~6mm |
|
Maximum substrate weight |
3kg |
|
Substrate edge clearance |
2.5mm |
|
Height of board |
15mm |
|
Transmission height |
900±40mm |
|
Transmission speed |
Segment control, speed 1500mm/s (Max) |
|
transfer method |
One-stage transmission rail |
|
Substrate clamping |
Automatic telescopic upper press, flexible clamping edge, vacuum adsorption function |
|
Substrate support method |
Magnetic ejector pin, height equalizer, manually adjustable lifting platform |
|
image |
|
Image View |
10×8mm |
|
Benchmark Type |
Standard shape reference points, pads, openings |
|
Camera System |
Up/down imaging vision systems, digital cameras, geometric matching |
|
performance |
|
System alignment accuracy and repeatability |
（±12.5um@6α，CPK≥2.0） |
|
Actual solder paste placement repeatability |
（±18um@6α，CPK≥2.0） |
|
Actual solder paste printing position repeatability verified by a third-party testing system (CTK, Germany) |
|
Printing cycle |
＜7.5sec (excluding printing and cleaning time) |
|
Printing parameters |
|
Maximum printing area |
530×340mm |
|
Printing Demolding |
0-20mm |
|
Printing Mode |
Single or double squeegee printing |
|
Scraper type |
Rubber scraper/steel scraper (angle 45/55/60) |
|
Printing speed |
6~200mm/sec |
|
Printing pressure |
0.5~10Kg |
|
Formwork frame size |
370×370mm~737~737mm |
|
Cleaning method |
Enhanced vacuum adsorption; three modes: dry, wet and vacuum; back and forth cleaning |
|
machine |
|
Power requirements |
AC220V±10%,50/60Hz，2.5KW |
|
Compressed air requirements |
4~6Kgf/cm² |
|
Air consumption |
about5L/min |
|
Working temperature |
﹣20℃~﹢℃ |
|
Working environment humidity |
30%~60% |
|
Equipment size (excluding tri-color light) |
L1158×W1400×H1530（mm） |
|
weight |
about1000Kg |
Keywords for product applications:
SMT Stencil Printer,SMT Solder Paste Printer,SMT Printing Machine,SMT PCB Printer,600mm Solder Paste Printer,Solder Paste Printer,1200mm Solder Paste Printer,
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