JHIMS S460 3D SPI Solder Paste Inspection

Name: JHIMS S460 3D SPI Solder Paste Inspection Machine
Brand: JHIMS
SKU: S460
Price: 21600 USD
Availability: InStock
Rating: 4.9 (36 reviews)

Product Number：S460

Product Usage：JHIMS 460 solder paste inspection machine is mainly used to inspect the printing quality of solder paste on PCB to ensure that the solder paste quantity and distribution meet the requirements.

Applicable Industries：JHIMS 460 solder paste inspection machine is widely used in electronic manufacturing, communications, automotive electronics, consumer electronics, medical electronics and industrial control industries to ensure the printing quality of PCB solder paste.

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Product Details

JHIMS S460 3D SPI Solder Paste Inspection Machine

In SMT assembly, precise solder paste deposition prevents up to 70% of defects. The JHIMS S460 uses innovative PSLM PMP technology for shadow-free 3D measurements, boosting first-pass yields by 20% in high-volume PCB production. As a leader in SMT inspection since 2005, Shenzhen Jinghe Technology delivers reliable solutions for global electronics manufacturing.

Why Choose JHIMS S460 for SMT Defect Reduction?

Traditional 2D SPI misses volume inaccuracies, leading to reflow failures. Our 3D SPI machine captures true height profiles with <1μm repeatability, integrating PSLM technology for zero mechanical wear. In 2025's miniaturized era, AI warp prediction analyzes PCB trends proactively, cutting inspection time by 15% over competitors like Viscom or Yamaha.

SMT Line Integration: Seamless closed-loop with printers for real-time corrections.
AI-Enhanced PSLM: Software-modulated gratings adapt to ±1200μm heights, ideal for red glue and epoxies.
Versatile for High-Density Boards: Supports 0201 components in automotive ECUs, medical implants, and 5G telecom.

LSI Optimization Tip: Focus on "SMT defect reduction" to align with rising queries for yield improvement in volatile markets.

Advanced Features of the S460 3D SPI Machine

Engineered for 24/7 operation, the S460 combines patented D-Lighting for full-spectrum detection with Stop & Catch multi-imaging, ensuring <1% measurement variance even on warped boards.

PSLM PMP Core: German-sourced tech eliminates shadows; 10-year warranty on optics.
Multi-Frame Acquisition: Enhances accuracy for irregular paste shapes, outperforming single-scan systems.
Full-Light D-Lighting: Detects opaque materials without noise, expanding beyond solder paste.
Gerber/CAD Automation: One-key Teach mode for 5-min programming; supports 274x formats.
SPC Analytics: CPK >1.67 via histograms—monitor trends to slash rework by 30%.
Z-Axis Dynamic Compensation: ±5mm warp handling with AI forecasting for FPCs.

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S460 Comprehensive Technical Specifications

Parameter	Description	Value
Series	Model Type	S460 Cost-Effective
Measurement Principle	Core Tech	3D White Light PSLM PMP (Moiré Fringe)
Key Measurements	Metrics	Volume, Area, Height, XY Offset, Shape
Detection Types	Defects	Missing Print, Insufficient/Excessive Tin, Bridging, Offset, Contamination
Camera	Pixel/Optics	5M; Telecentric + Coaxial Light
Resolution	Lens Detail	16μm/13μm
Min Element	Support	British 0201
Accuracy	XY/Height	1μm / 0.37μm
Repeatability (3σ)	Precision	Height: <1μm; Volume/Area: <1%
Gage R&R	Variability	<10%
FOV Speed	Efficiency	0.45s per Field
Heads	Config	Single
RGB Lighting	Standard	Included
Mark Detection	Time	0.5s/piece
Warp Compensation	Z-Axis	Standard (±5mm)
Max Height	Range	±550μm (±1200μm Option)
Min Pad	Spacing	150μm
Max PCB	Size/Thickness	460x460mm / 0.4-7mm
Part Heights	Limits	Up: 30mm; Down: 40mm
Edge Distance	Board	3mm (Clip Option)
Orbit	Setup	Front (Back Option)
Transfer Dir.	Flexible	L-R or R-L; Manual/Auto Adjust
SPC Tools	Analytics	Histogram, Xbar-R/S, CP/CPK, Reports
Data Input	Gerber/CAD	274x/D; Teach Mode; X/Y Import
CPU/RAM/GPU	IPC	i7 / 24G (32G Opt) / 2G (4G Opt)
Storage/OS	Config	1TB SSD / Windows 10 Pro 64-bit
Dimensions/Weight	Footprint	1000x1150x1525mm / 965kg
Power/Air	Req.	220V 10A / 4-6 Bar
Usage	Start/Normal	2.5kW / 2kW
Floor Load	Min.	600kg/m²
Options	Add-Ons	Barcode, Offline Prog., UPS, Ultrasonic

Z-Axis Profiling: Tackling PCB Warp in 2025 Production

Warpage impacts 30% of SMT runs; S460's AI-driven Z-axis profiles per-FOV, compensating ±5mm dynamically—essential for FPCs in wearables. Unlike static systems, our PSLM tech predicts distortions via ML algorithms, reducing false positives by 25%.

JHIMS S460 3D SPI Z-Axis Warp Compensation for PCBs

From flexible substrates to rigid boards, achieve sub-micron accuracy. Deep Dive: Warp Challenges in SMT.

JHIMS S460 Flexible FPC PCB Solder Paste Inspection

Closed-Loop M2M Integration for Zero-Defect Lines

Boost efficiency: S460 shares badmark data with placers, skipping defects to save 30% mounting time. Printer feedback auto-cleans stencils post-missing prints—proven with GKG/Desen models.

JHIMS S460 SPI Closed-Loop with Printer for SMT Optimization

Barcode-enabled for multi-run traceability. Full M2M Solutions Guide.

JHIMS S460 Badmark Sharing with Pick-and-Place for Efficiency

Real-World Applications and Proven ROI

Deploy S460 in automotive (EV battery PCBs), medical (implant sensors), and consumer 5G modules for high-reliability needs. It excels in jet-printing vs. screen, handling 50% faster inspections per TRI benchmarks.

Case Study: A 2025 Shenzhen firm integrated S460 into their SMT line, yielding 25% defect drop and 6-month ROI via 15% throughput gain—CPK from 1.2 to 1.8.

"Transformed our yields—essential for scaling production." — Lead Engineer, TechCorp (150+ installs).

Interactive ROI Tool: Estimate savings based on your volume. Calculate Now.

LSI Expansion: Integrate with AOI for end-to-end "SMT defect reduction," aligning with Industry 4.0 trends like predictive maintenance.

Testimonials: Voices from the Field

"S460's AI warp handling saved us hours weekly." — Auto Manufacturer, 5/5 stars.
"Seamless Gerber import—setup in minutes!" — Medical Device Firm, 4.8/5.
"Closed-loop magic for our high-mix lines." — Telecom Producer, 5/5.

FAQs: Mastering 3D SPI Solder Paste Inspection

What sets PSLM technology apart in 3D SPI machines?: Software-driven phase shifts eliminate mechanical errors, enabling adjustable heights up to ±1200μm without parts—far superior to moiré fringes.
How does AI integration future-proof the S460 for 2025?: ML-based warp prediction flags issues pre-scan, boosting speed 15% over traditional Z-axis systems in FPC-heavy production.
Closed-Loop Setup: Compatible Equipment?: Works with GKG/Desen printers and Badmark-enabled placers; requires open protocols.
ROI Timeline for S460 Implementation?: Typically 4-8 months; use our calculator for personalized projections based on line speed and defect rates.