Ⅰ、Solution Overview

COB (Chip On Board) displays use bare chips directly packaged on PCB substrates, and achieve miniaturization, high reliability and high performance through high-precision equipment and automated processes. The overall solution aims at automation, flexible production and online quality monitoring, and is suitable for large-scale customized production and multi-model mixed production.

 

Ⅱ、 Manufacturing process and key equipment

(1) PCB loading and pretreatment

PCB loader

Automatically transports the PCB to be processed to the production line to ensure accurate and efficient loading.

PCB surface cleaner

Dust-free cleaning of PCBs to remove dust, oil and other impurities, provide good surface conditions for subsequent processes (such as solder paste printing and solid crystal), and ensure welding and bonding quality.

(2) Solder paste process

Solder paste printer

Precisely prints solder paste on PCB pads, using high-precision template technology to ensure that the solder paste amount, thickness and position meet the process requirements.

Solder Paste Inspection Machine

Performs online inspection on printed solder paste to check for printing defects, printing amount deviation and bad position, ensuring the stability of subsequent welding quality.

(3) Chip Bonding and Mounting

Chip Bonding Machine

It is a chip mounting equipment that directly sticks the bare chip (COB core device, such as display driver chip or LED chip) to the designated area of ​​PCB through high-precision positioning, and completes the pre-bonding (glue dispensing) process at the same time. It can also be combined with the automated line for wire bonding or ball welding packaging.

First AOI Inspection Machine

Performs preliminary inspection after bonding to verify the chip mounting position, bonding glue amount and solder paste printing quality, and promptly removes obvious defective parts.

(4) Welding Process

Reflow Soldering Machine

Performs reflow soldering with precise temperature curve control on printed solder paste and mounted components to ensure that the solder paste is fully melted at an appropriate temperature and forms reliable solder joints.

Second AOI Inspection Machine

Performs a second automatic optical inspection after welding to confirm the solder joint quality, device position and welding defects, ensuring that the overall soldering process meets the standards after reflow soldering.

(5) PCB unloading and subsequent testing

PCB unloading machine

Automatically unloads the PCB board that has completed the welding test from the production line to prepare for subsequent testing and packaging.

COB functional testing machine

Finally, a dedicated testing equipment is used to perform functional testing on the entire COB display, including electrical testing, display effect (brightness, color uniformity, contrast, etc.), dynamic response and stability testing to ensure that the product meets the design and customer requirements before leaving the factory.

 

Ⅲ、Equipment integration and automation management

1.Automation control system**

The entire line of equipment is linked and controlled through PLC or industrial PC to automatically perform loading, testing, data collection, defect feedback and tracking.

2.MES system docking

Real-time recording of production data, process parameters and batch information facilitates quality traceability and process optimization, ensuring data interconnection in all links.

3.Online monitoring and early warning

The equipment operation status, process parameters and test results can be monitored in real time. Automatic alarm will be issued when abnormalities occur, and timely intervention and maintenance will be carried out to ensure production continuity and product stability.

 

Ⅳ、Quality management and process control

1. Multi-stage online inspection

AOI inspection links are set up from solder paste printing to reflow soldering to achieve the goal of zero defects.

2. Standardization of process parameters

Detailed operating specifications and process parameters are formulated for each process to ensure repeatability and consistency.

3. Equipment maintenance and calibration

Establish regular maintenance and calibration plans to ensure equipment accuracy and stability and extend equipment life.

 

Ⅴ、Solution advantages

1. High automation and flexible production

Full process automation greatly reduces manual intervention and improves production efficiency, and the modular design of equipment supports flexible production of multiple models of COB display screens.

2. Full-process quality control

Multi-stage inspection and data traceability ensure product consistency and reliability.

3. Reduce production costs

Accurate process control and automated equipment reduce rework rate and labor costs, effectively improving production capacity and market competitiveness.

 

Ⅵ、Implementation suggestions

1. Select appropriate equipment configuration according to production scale and product model. It is recommended to conduct trial production and debug process parameters first;

2. Develop detailed operating procedures and training plans to ensure that production personnel are proficient in equipment operation and maintenance;

3. Establish a data collection and feedback mechanism to continuously optimize the process flow using production data;

4. Reserve flexibility for equipment upgrades and module replacements based on market demand and product updates.

 

      This solution covers the entire process of automated production from PCB loading, cleaning, solder paste printing and testing, chip bonding, reflow soldering, comprehensive testing to final functional testing, ensuring high quality, high stability and high production efficiency of COB display screens. If there are more detailed product requirements or process customization requirements, the equipment parameters, process flow and system integration solutions can be further discussed and optimized.

 

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