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Location： Home » Product Center » AOI SPI X-Ray Series » X-Ray machine

X-ray universal inspection machine | JHIMS

X-ray universal inspection machine | JHIMS

Product Number：X540

Product Usage：JHIMS X540 X-ray inspection machine is mainly used to quickly detect the internal structure or content of objects through X-ray fluoroscopy technology to achieve non-destructive testing, safety inspection or quality control.

Applicable Industries：JHIMS X540 is a cost-effective universal offline precision micro-focus X-ray inspection machine, mainly used for semiconductor, SMT, DIP, electronic components inspection, covering IC, BGA, CSP, flip chip and other packaging types inspection, can also be used for automotive parts, aluminum die-casting molds, LED, battery, photovoltaic industry and molded plastics, ceramic products and other special industries inspection, can be customized according to customers X-Ray inspection machine.

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Product Details

X-ray universal inspection machine

JHIMS X540 is a cost-effective universal offline precision micro-focus X-ray inspection equipment, suitable for the inspection of offline products in various factories. It has the characteristics of high magnification of 200X, detection accuracy of 5~15μm, multi-angle detection, large-area detection platform, etc. It can be customized according to customer product inspection needs.

1、Advantages:

●Meet general X-ray detection needs and have a wide range of applications

●High-resolution design to obtain the best image in a very short time

●Infrared automatic navigation positioning, quickly select the shooting position

●CNC detection mode, fast and automatic detection for multi-point arrays

●Tilted multi-angle detection makes it easier to detect sample defects

●The software is simple and easy to use, with low operating costs

●The light tube plate can be rotated at the same time (0-60°), making the detection image clearer and more intuitive

2、Fully automatic bubble ratio calculation

It can quickly select and mark a single solder ball, or select the solder balls to be tested by matrix selection, and can manually or automatically identify BGA solder balls and complete the test. Easily complete the test process according to the system guidance and ensure accurate and reliable test results.

3、Dimensional Measurement

Distance, distance ratio, line spacing, angle, arrow mark, circle radius, point distance, center distance, perimeter, hand-drawn polygon, hand-drawn free form, etc., text description can be added

4、Defect Detection

1. JHIMS X540 X-Ray can automatically identify defects such as size, area, broken wire, and solder joints.

2. Develop specific software algorithms based on customer product characteristics to achieve fully automatic defect recognition and detection functions, including presence, cracks, broken wires, offsets, size, and quantity.

5、X-ray tube parameters

Light tube type: reflective sealed micro-focus ray source

Operating voltage: 40-90KV

Operating current: 10-200μA

Maximum output power: 8W

Micro-focus size: 5~15μm

6、Flat panel detector parameters

Flat panel type: amorphous silicon flat panel detector (optional)

Pixel matrix: 768x768/1536×1536

Field of view: 65mmx65mm/130mm×130mm

Resolution: 5.8Lp/mm

Image frame rate: (1×1) 40fps/20fpsAD

Conversion bit number: 16bits

7、X-Ray machine performance parameters

Dimensions: L1200mm×W1200mm×H1800mm / L1245mm×W1230mm×H1900mm

Control system: Industrial computer WIN10 64-bit

Maximum sample size: 540mm×440mm

Input power: 220V 10A 50-60HZ

Net weight of equipment: about 1072KG / 1170KG

8、JHIMS X-Ray Detection Application Examples

X-Ray_inspection_of_white_light_soldering_iron_tips

X-Ray_inspection_of_electronic_cigarettes_(ceramics) X-Ray_inspection_of_rubber_hose X-Ray_inspection_of_Xiaomi_mobile_phones X-Ray_inspection_of_BGA_chips

X-Ray_detection_of_LED_lamp_beads X-Ray_inspection_of_IC_semiconductors X-Ray_inspection_of_memory_chips X-Ray_inspection_of_fuses

X-Ray_inspection_of_OPPO_mobile_phone X-Ray_inspection_sensor X-Ray_inspection_of_smart_switches X-Ray_inspection_intercom

X-Ray_inspection_of_the_tin_content_of_the_filling_holes X-Ray_inspection_of_water_purifier_(plastic_barrel) X-Ray_inspection_of_IC_semiconductors1 X-Ray_inspection_of_Apple_camera_modules

X-Ray_Inspection_of_Apple_Computer_Power_Cords X-Ray_inspection_of_thermal_sensors X-Ray_inspection_of_diode_capacitance X-Ray_Inspection_of_Apple_PC_Power_Cords